During the post CMP cleaning process in semiconductor manufacturing, it is important to remove organic residues and particles on Cu wires and Low-k films without damaging the substrate. Our product, MXC-SDR4, is a high-efficiency cleaning solution suited for semiconductor industries. 

Characteristics:
-High efficiency particle removal
-Removes organic residues effectively
-Limits galvanic corrosion on Cu wire
-Limits Low-k damage
-Improves Low-k wetting properties

To Post Cu/Low-k CMP Cleaning Solution, "MCX-SDR4" Product Information Page

In recent years, the demand is increasing for high quality removal of particles and metals from small size semiconductor circuits during silicon wafer cleaning process. Star Series meets those demands with semiconductor process chemicals having metal impurity levels below 10ppt.

Products: Sulfuric acid, Nitric acid, Hydrochloric acid, Acetic acid, Ammonia solution, Hydrogen peroxide, Isopropyl alcohol

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AM1 is a high-performance electronic chemical solution used as an alternative RCA clean for batch and single wafer applications.  It has the capability to remove both particles and metal impurities.  Furthermore, it has superior performance for metal gate cleaning because it does not corrode silicon.
Features:
・Single wafer cleaning (realize superior surface cleanliness in a short time)
・Metal gate cleaning (no corrosion of tungsten or silicon)

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MC1 is an electronic chemical processing solution which is a high-performance alternative RCA clean.  MC1 contributes to the customer`s total cost reduction, because it can remove both particles and metals, thus reducing the number of steps of RCA cleaning.
Features:
・Reduction of metal contamination
・Prevention of cross contamination

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This is an electronic chemical used in wet etching in semiconductor manufacturing.  We are providing the next etching solutions needed by the industry.
Si etchant, Al etchant, Cr etchant, Au etchant, Ag etchant

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